Component-Level Soldering: Solder and desolder fine-pitch SMT components, passives (down to 0201 or 01005 footprints), QFNs, and multi-pin connectors manually under a microscope.
BGA Rework: Operate specialized BGA rework stations to safely remove, reball, and replace high-density Ball Grid Arrays (BGAs) and System-on-Chips (SoCs)....