VisionPower Semiconductor Manufacturing Company (VSMC) Hiring! Process Integration Engineer (Credit Bearing Internship) in - Ricebowl

About the Role

Join our 12-inch wafer fabrication facility as a Process Integration Engineer Intern and gain exposure to how individual semiconductor processes work together to build high-performance devices. You will work with experienced engineers across different process modules to analyze device and process data, troubleshoot integration issues, and support process and yield improvement projects.

Key Responsibilities

• Support Process Integration Engineers in monitoring overall process and device performance across multiple process modules.
• Analyze wafer, process, and electrical test data to identify trends, abnormalities, and improvement opportunities.
• Assist in troubleshooting process integration issues and conducting root-cause analysis.
• Support engineering experiments, process development, and optimization activities.
• Participate in yield improvement and defect reduction projects.
• Collaborate with Process, Equipment, Device, Yield, and Manufacturing Engineering teams to resolve integration issues.
• Assist in evaluating process changes and their impact on device performance and manufacturability.
• Support data analysis, engineering reports, presentations, and technical documentation.
• Follow fab safety, quality, and operational procedures in a cleanroom environment.

Requirements

• Pursuing a Bachelor's degree in Electrical, Electronics, Chemical, Materials, Mechanical, Mechatronics, Semiconductor Engineering, or a related discipline.
• Strong interest in semiconductor devices, manufacturing, and process integration.
• Good analytical and problem-solving skills with attention to detail.
• Comfortable working with technical data and interpreting experimental results.
• Good communication and teamwork skills.
• Willing to work in a cleanroom and fast-paced manufacturing environment.
• Knowledge of semiconductor fundamentals, statistics, data analysis, or programming is an advantage.

What You Will Gain

• Hands-on exposure to 12-inch wafer fabrication and semiconductor process integration.
• Understanding of how multiple process modules interact to form semiconductor devices.
• Practical experience in process optimization, yield improvement, and integration troubleshooting.
• Exposure to wafer-level and electrical test data analysis.
• Experience working on cross-functional engineering projects in a high-tech manufacturing environment.