Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.
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Data Center Operations
Infrastructure Support
Network Cabling
Fiber Optics
Ethernet Switching
IP Addressing
VLAN
Cable Troubleshooting
Hardware Installation
Server Racking
Cable Management
Windows 10
Windows 11
Windows Server 2019
Windows Server 2022
VMware vSphere
Microsoft Failover Cluster
Microsoft NLB Cluster
Troubleshooting
Customer Service
Microsoft Office Suite
ServiceNow
Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.
Strong analytical thinking and problem-solving skills.
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