-Carry out repairs, troubleshooting, and back-end engineering maintenance works to ensure consistent and reliable operational support.-Maintain and operate various mechanical, electrical, medical, and specialist systems in accordance with their design intent and operational requirements.-Ensure all required deliverables and contractual obligations are met.-Support the hospital’s daily operations, particularly in front-end engineering services, while meeting client expectations and contractual requirements.-Execute corrective, reactive, and planned preventive maintenance within the allocated resources and operational framework.-Carry out and manage minor repairs and corrective maintenance works.-Work closely with other service providers within the hospital to maintain a safe, reliable, and well-functioning environment for patients, staff, and visitors.-Support ISS’s integrated facilities management model by ensuring operations are productive, efficient, and effective.-Coordinate and maintain good working relationships with specialist subcontractors and contractors appointed by the hospital.-Monitor contractors and service providers to ensure they meet the required KPIs, service standards, client expectations, and contractual deliverables.
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes
Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
...
CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes