14份Die Attach工作在Singapore - October 2026
显示14个工作的结果
"die attach"
在 Singapore
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago