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4份Backgrind 工作机会 - 最新工作招聘 - June 2026
显示4个工作的结果 "
backgrind
"
不要错过任何 Backgrind 的新工作机会
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工作
"backgrind"
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Process Associate Engineer (PAE) - Die Preparation
Process Associate Engineer (PAE) - Die Preparation
Agensi Pekerjaan Inter Island Sdn Bhd
SGD3,000 - SGD4,800 每月
全职
Singapore
,
Singapore
Requirement
• Degree in electrical / mechatronics / mechanical/ microelectronics engineering or similar discipline
• Minimum 2 years’ experience working in semiconductor manufacturing environment
...
Backgrind
Dicing
所需技能
Backgrind
Dicing
Laser Grooving
+1
最后机会申请此工作。
Posted
7 hours ago
现在申请
高机会
查看相似职位
Equipment Associate Engineer (EAE) - Die Preparation / Recon
Equipment Associate Engineer (EAE) - Die Preparation / Recon
Agensi Pekerjaan Inter Island Sdn Bhd
SGD3,000 - SGD4,800 每月
全职
Singapore
,
Singapore
Requirements
• Degree in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science
• or equivalent.
...
Carrier Lamination
Pick & Place
所需技能
Carrier Lamination
Pick & Place
Wafer Saw
Wafer Backgrind
Laser Grooving
Wafer Mounting
Taping & Detaping
Moudling
+6
最后机会申请此工作。
Posted
7 hours ago
现在申请
高机会
查看相似职位
Process Engineer (Flip Chip - Mold -Backgrind - Wafer Saw)
Process Engineer (Flip Chip - Mold -Backgrind - Wafer Saw)
Unisem (M) Berhad
Undisclosed
全职
Gopeng
Posted
21 days ago
现在申请
Process Engineer (Flip Chip - Mold -Backgrind - Wafer Saw)
Process Engineer (Flip Chip - Mold -Backgrind - Wafer Saw)
UNISEM (M) BERHAD
Undisclosed
全职
Gopeng
Posted
21 days ago
现在申请
浏览位置:
perak
(2)
singapore
(2)
浏览公司:
Agensi Pekerjaan Inter Island Sdn Bhd
(2)
按"backgrind"浏览工作:
全职
(4)
居家办公
按"backgrind"浏览工作:
Engineering / Maintenance
(2)
Other Industries
(2)