800+份Application Engineering工作在Singapore - October 2026

显示845个工作的结果 "application engineering" 在 Singapore
不要错过任何 Application Engineering 的新工作机会 在 Singapore
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
a month ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
a month ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
a month ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
a month ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
a month ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
a month ago

Singapore

Posted
12 days ago

Singapore

Posted
11 hours ago

Singapore

Posted
21 days ago

Singapore

Posted
18 hours ago

Singapore

Posted
21 days ago

ONESYSTEMS TECHNOLOGIES PTE. LTD.

Singapore

Posted
2 days ago

D'MARK TECHNOLOGIES (S) PTE. LTD.

Singapore

Posted
2 days ago

Singapore

Posted
a day ago

Onesystems Technologies Pte. Ltd.

Yishun

Posted
a day ago

Woodlands

Posted
a day ago

ONZZ ENGINEERING AND TRADING PTE. LTD.

Singapore

Posted
3 days ago

Kallang

Posted
3 days ago

SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD

Singapore

Posted
4 days ago

USER EXPERIENCE RESEARCHERS PTE. LTD.

Singapore

Posted
5 days ago

Singapore

Posted
6 days ago

Singapore

Posted
8 days ago

Singapore

Posted
9 days ago

Singapore

Posted
12 days ago

Singapore

Posted
13 days ago

Singapore

Posted
13 days ago

Singapore

Posted
14 days ago

Singapore

Posted
16 days ago

Singapore

Posted
16 days ago

Singapore

Posted
16 days ago