jobs in NXP Semiconductors

Package Roadmap Tool Intern – Package Innovation 工作, NXP Semiconductors Federal Territory 公司招聘中 - Ricebowl

Package Roadmap Tool Intern – Package Innovation

KL City, Federal Territory

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工作地点

  • Kuala Lumpur Federal Territory Malaysia

职位描述

岗位职责

Role Summary

Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.

Key Responsibilities

  • Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
  • Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
  • Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
  • Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
  • Collaborate cross-functionally with platform, API, and manufacturing teams

Additional Exposure

  • Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows

Qualifications

  • Degree candidate in Computer Science (preferred), Engineering, or related field
  • Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks)
  • Experience with Excel, Power BI, or similar tools for visualization and tool development
  • Ability to translate technical inputs into structured, scalable frameworks
  • Self-driven with strong collaboration and communication skills

More information about NXP in Malaysia...

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