全职 Senior Staff Engineer Equipment Engineering 工作, 薪水, Randstad Malaysia Federal Territory 公司招聘中 - Ricebowl

Role Overview

We are representing a Fortune 500 Semiconductor Company, seeking a highly technical Equipment Engineering Leader to drive Surface Treatment & Metrology equipment performance. This role focuses on optimizing equipment reliability, integrating advanced process control (APC) tools, and establishing rigorous planned maintenance and continuous improvement frameworks to achieve strict operational and cost (TCR) targets. The ideal candidate bridges the gap between complex hardware/software troubleshooting and shop-floor reliability while developing a highly competent technician team.

Key Responsibilities

• Equipment Governance: Govern and execute Surface Treatment and Metrology equipment from conceptualization and piloting through to implementation, monitoring, and sustaining.
• Maintenance & Reliability: Setup and execute systematic planned, preventive, and predictive maintenance routines to ensure equipment availability, safety, and budget adherence.
• Continuous Improvement: Diagnose previous maintenance activities to accelerate optimal machine performance and implement countermeasures to prevent repetitive breakdowns.
• System Integration: Monitor equipment stability by integrating machinery with APC tools and semi-auto integration systems.
• Team Leadership: Develop, evaluate, and certify a team of technicians according to strict competency models to support sustainable manufacturing excellence.
  
  

Qualifications & Skills

• Education: Master’s or Bachelor’s Degree in Mechanical Engineering, Electrical Engineering, Materials Engineering, Chemical Engineering, or Manufacturing Engineering.
• Experience: Minimum 8–10 years in semiconductor manufacturing, with at least 5 years of direct hands-on experience with surface treatment equipment (Plating, Deflashing, Chemical Dipping, etc.).
• Technical Expertise: Deep knowledge of equipment maintenance systematics, Maintenance FMEA, risk assessment, and semiconductor backend assembly processes.
• Bonus Skillset: Strong foundational knowledge of electroplating and electroless plating fundamentals.