全职 Associate Engineer, Equipment (Die Prep-Recon-Pick and Place) 工作, 薪水, SILICON BOX 公司招聘中 - Ricebowl

Position Summary

The Equipment Associate Engineer is responsible for maintaining and troubleshooting cleanroom equipment to support stable and efficient manufacturing operations. This role supports engineering and production teams through equipment setup, documentation, and continuous improvement initiatives to enhance yield and productivity.

Responsibilities

• Perform equipment Line Sustaining function (corrective maintenance), preventive maintenance, predictive maintenance, and calibration.
• Sustain and improve overall equipment performance (OEE).
• Update consumables/spare parts to ensure no delay in machine recovery due to no spare.
• Participate in and contribute to continuous improvement activities for yield, maintenance cost, equipment modification and productivity improvement.
• Assist Engineers in setting up new machine and buy-off.
• Maintain good housekeeping and safety practices in the cleanroom.
• Communicate with supervisors, fellow shift personnel and vendors to resolve problems.
• Timely update and ensure data integrity of pass down report, PM Checklist and other similar reports, checklists and documents.
• Comply safety standards and procedures during shift duty or working in the production line.
• Responsible for maintenance and repairs on the assigned equipment.
• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance.
• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.
• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.
• Any other ad-hoc duties as assigned.

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.
• Minimum 3 years’ relevant experience in semiconductor/ LCD/ electronics/ electrical industry.
• Minimum 3 years’ experience in maintenance and troubleshooting of equipment, preferably in the semiconductor industry
• Has hands-on experience in handling equipment for any of the following areas: Carrier Lamination, Pick and Place, Wafer Saw, Wafer Backgrind, Laser grooving, Wafer Mounting, Taping and Detaping, Molding (Compression, Transfer, or Injection), Oven curing/annealing; Wet Etch/ Plating, Lithography, Metrology tools for wafer/panel inspection in semiconductor industry (packaging assembly); backgrind, ball drop, laser marking, tape and reel
• Able to work in both day and night rotating shifts, and flexible to work under various shift patterns.