Responsibilities:
- Ensure processes meet customer specifications and conduct failure analysis to identify root causes and implement corrective actions.
- Develop and optimize gold, silver and copper wire bonding processes to improve quality, stability and performance.
- Coordinate NPI, NPQ and qualification activities for new products, materials, devices and equipment.
- Support new tape and material development, supplier qualification and technology benchmarking.
- Maintain, troubleshoot and perform minor repairs on assembly and testing equipment.
- Develop and update SOPs, train colleagues on new processes and equipment, and participate in internal and external audits.
- Ensure compliance with company quality, environmental, health and safety requirements.
Requirements:
- Diploma or Degree in Electronics Engineering or Materials Science.
- Minimum 3 years of manufacturing experience, preferably in semiconductor assembly and testing.
- Familiarity with FMEA, SPC, OCAP, DOE, ISO 9001, ISO 14001, QEMS, CQM and JEDEC standards.
- Strong analytical, problem-solving and communication skills, with the ability to multitask and work independently in a fast-paced environment.
- Knowledge of bonding wire materials, encapsulants, substrates and IC assembly processes, including die attach, wire bonding, encapsulation and testing.
- Experience in maintaining assembly and testing equipment.
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below.
EA License No: 13C6305
Reg. No.: R1985234 (GOH HOOI MING)
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