全职 MTS - Process Integration Lead (TD) 工作, 薪水 up to SGD 9,000, GLOBALFOUNDRIES SINGAPORE PTE. LTD. North Region (Singapore) 公司招聘中 - Ricebowl

About GlobalFoundries

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity, and sustainability. For more information, visit *************.

Introduction:

Process integration lead in development, optimization, and qualification of semiconductor devices/processes to meet performance requirements.

Responsibilities:

• Lead process integration activities for the development, optimization, and qualification of RF semiconductor technologies, ensuring device performance, manufacturability, yield, and reliability targets are achieved.
• Design, execute, and analyze Design of Experiments (DOE) to drive process understanding, optimization, and technology development.
• Partner closely with process module, device, yield, reliability, and manufacturing teams to improve product performance and process capability.
• Own and drive complex technical problem-solving activities, utilizing data-driven methodologies to identify root causes and implement robust solutions.
• Serve as the primary technical interface for internal and external customers, addressing technical inquiries and supporting customer engagements.
• Define and establish technology design rules, process monitors, test structures, characterization plans, and qualification methodologies for new technology platforms.
• Drive continuous innovation through the development of novel integration schemes, methodologies, and process improvements to enhance technology competitiveness.
• Mentor junior engineers and provide technical leadership across cross-functional development programs.

Required Qualifications:

• Bachelor’s, Master’s, or PhD degree in Electrical Engineering, Electronics Engineering or equivalent.
• Minimum 6 years of relevant semiconductor industry experience with a PhD, or 8 years with a Bachelor’s/Master’s degree.
• Strong wafer fabrication process knowledge with proven experience in FEOL process integration and technology development.
• Demonstrated ability to lead cross-functional technical projects and drive issues to resolution in a fast-paced development environment.
• Strong analytical, problem-solving, and data interpretation skills.

Preferred Qualifications:

• Hands-on experience in RF-SOI technology development, integration, characterization, and qualification.
• Understanding of semiconductor device physics, RF device behavior, and RF characterization techniques (e.g., S-parameters) is a plus.
• Experience in process optimization, yield enhancement, reliability qualification, and root-cause analysis methodologies.
• Self-motivated, resourceful, and adaptable, with a strong commitment to continuous learning and technical excellence.
• Excellent communication, leadership, and interpersonal skills, with the ability to influence and collaborate effectively across multidisciplinary teams.
• Experience interfacing with customers and presenting technical results to senior management and external stakeholders.