jobs in ASE SINGAPORE PTE. LTD.

全职 Industrial Engineer 工作, 薪水 up to SGD 4,500, ASE SINGAPORE PTE. LTD. North Region (Singapore) 公司招聘中 - Ricebowl

Industrial Engineer

ASE SINGAPORE PTE. LTD.

Woodlands, North Region (Singapore)

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工作地点

  • Woodlands North Region (Singapore) Singapore

职位描述

岗位职责

Responsibilities

Conduct time studies to set precise standards for machine capacity and cycle time

Use data analytics platforms to ensure accurate production loading assessments and resource allocation

Collaborate with Operations and Engineering teams to drive OEE improvements

Initiate, analyze, plan, and execute reconfiguration projects to maximize tester utilization

Plan and manage testers and related hardware & software, overseeing transfer in/out activities and ensuring alignment with company goals

Maintain robust spare parts inventory and ensure availability and readiness for production needs

Requirements

Degree in Industrial Engineering, Electrical Engineering, Mechanical Engineering, or any related Engineering discipline

Proficient in Microsoft Office (Word, Excel, PowerPoint)

Strong analytical skills with a flair for numbers and data-driven decision-making

Excellent interpersonal and communication skills, both written and verbal

Ability to adapt to changing environments and manage multiple tasks efficiently

Ability to work well as a team player while being independent and proactive in problem-solving

Positive attitude, growth mindset, and eagerness to learn and develop new skills.

Exposure to manufacturing or production environments is a plus

Fresh graduates are welcome to apply

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.

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