- Malaysia
工作地点
职位描述
岗位职责
Senior Process Engineering | Full-time
Location: Perai, Penang, Malaysia(must to on-site)
Position Overview
Oversee all surface mount technology (SMT) process activities, troubleshoot technical issues, and improve production efficiency. This role provides process instructions to manufacturing teams, designs stencils, trays, and fixtures, and drives process improvements to increase yield and improve product quality.
Key Responsibilities
- Oversee SMT process activities, resolve technical issues, and improve production efficiency.
- Develop and provide SMT work instructions (WIs) and process specifications for manufacturing teams.
- Prepare engineering analyses and reports, including Design for Manufacturability (DFM), Gauge Repeatability and Reproducibility (GR&R), process capability (Cpk), and Failure Mode and Effects Analysis (FMEA).
- Design stencils, production trays, and fixtures.
- Drive process improvements to increase yield, improve product quality, reduce scrap, and shorten production cycle times.
- Implement and evaluate engineering changes (ECs).
- Support the introduction and transfer of new products, processes, fixtures, equipment, and technologies.
- Investigate customer complaints and product issues, and conduct verification tests as needed.
- Provide accurate data, reports, and recommendations to management as needed.
- Understand customer requirements and work with the team to meet customer expectations.
Qualifications
- Diploma or higher in Electronics Engineering, Mechanical Engineering, or a related field.
- Ability to prepare, review, and maintain engineering documentation.
- Proficiency in Microsoft Office (Word, Excel, and PowerPoint) and Minitab.
- Ability to work independently with minimal supervision.
- Strong leadership skills, a proactive approach, and a commitment to high-quality work.
- In-depth expertise in SMT process optimization, including stencil aperture design, solder paste printing parameter setup, and reflow profile tuning.
- Hands-on experience with reflow soldering, wave soldering, underfill, glob-top encapsulation, press-fit assembly, and PCBA cleaning.
- Experience with DEK stencil printers, ASM equipment, automated optical inspection (AOI) systems, X-ray inspection systems, and PCB depaneling routers is preferred.
- Willingness to travel approximately 5% of the time.
重要安全守则
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