全职 Senior Packaging Engineer – Power Modules (Semiconductor) 工作, 薪水, Randstad Malaysia Melaka 公司招聘中 - Ricebowl

About The Company

Our client is an established global semiconductor manufacturer specialising in advanced semiconductor technologies and packaging solutions. As part of its ongoing technology development initiatives, the company is seeking an experienced Packaging Engineer to drive power module packaging development, process integration, and new product introduction.

About The Job

• Lead packaging engineering and development activities for advanced semiconductor power modules, covering package structure, material selection, process integration, and manufacturability.
• Develop and optimise packaging processes, including component attach, flip-chip, reflow, molding, and substrate/leadframe assembly technologies.
• Drive new product development from prototyping, process characterisation, qualification through to manufacturing release.
• Evaluate package configurations, material compatibility, and reliability requirements to ensure robust package performance.
• Collaborate with cross-functional engineering, R&D, manufacturing, and global technical teams to support technology development and process improvements.
• Drive yield improvement, process optimisation, defect reduction, and manufacturing cost competitiveness.
• Apply engineering methodologies such as DOE, FMEA, SPC, and statistical analysis to resolve technical challenges.
  
  

About The Requirement

• Bachelor's Degree in Mechanical Engineering, Materials Science, Electrical/Electronic Engineering, Physics, or related disciplines.
• Preferably 5–12 years of experience in semiconductor packaging engineering or development, with hands-on exposure to power modules.
• Strong fundamental understanding of module package structures, configurations, process integration, and material compatibility.
• Experience in semiconductor packaging process development, material selection, assembly integration, or package reliability.
• Familiarity with advanced packaging technologies such as SiP, ETS, MIS, PoL, SMT, substrate/leadframe packaging, or TO/SiC/GaN power modules will be an added advantage.
• Knowledge of DFM, process optimisation, and semiconductor assembly technologies.
• Experience in project management, particularly in packaging development, NPI, or semiconductor assembly operations, is advantageous.
• Strong analytical, problem-solving, and cross-functional collaboration skills.