Manage plating-related processes, including Desmear, Electroless Plating, and Post-Plating Annealing.
Lead equipment installation, qualification, and engineering projects.
Develop process qualification plans, DOE, FMEA, and evaluation procedures.
Monitor and improve production yield, process stability, and output capacity.
Troubleshoot process issues, identify root causes, and implement corrective actions.
Coordinate with internal departments and equipment/material suppliers.
Support continuous improvement, process control, and production team training.
Job Requirements
Bachelor's Degree in Engineering, Materials Science, or a related field.
Minimum 5 years of relevant experience in semiconductor, PCB, substrate fabrication, wafer fabrication, assembly and test, maintenance, or production operations.
Experience working in a cleanroom environment.
Knowledge of quality tools such as SPC, MSA, DOE, FMEA, 8D, Control Plan, JMP, or Six Sigma.
Strong analytical, problem-solving, and communication skills.
Able to work independently, manage multiple tasks, and perform under pressure.