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全职 Mold Process Engineer (Operation - Sustaining) 工作, 薪水, MVC Resources Melaka 公司招聘中 - Ricebowl

Mold Process Engineer (Operation - Sustaining)

Malacca City, Melaka

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工作地点

  • Malacca City Melaka Malaysia

职位描述

岗位职责


Company Overview


Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. The Melaka manufacturing site serves as a key global hub for high-reliability back-end packaging, assembly, and testing. To maintain zero-defect output, maximize yield, and maintain automated encapsulation systems, the Process Engineering department is seeking a hands-on Mold Process Engineer.

Position Overview


Reporting to the Mold Section Manager, the Mold Process Engineer provides daily line-sustaining, process optimization, and defect-elimination support across automated molding lines. This operational engineering role focuses on managing Epoxy Molding Compound (EMC) rheology, minimizing machine downtime, and driving root-cause defect elimination across auto-molding systems.

Key Responsibilities


1. Daily Line-Sustaining & Defect Resolution

  • Provide daily process engineering support for high-volume transfer and compression molding production lines.

  • Troubleshoot, contain, and eliminate critical molding defects—including voiding, package warpage, compound flash/bleeding, wire sweep, and package delamination.

  • Manage Epoxy Molding Compound (EMC) parameters, evaluating compound flow, gel time, resin rheology, pellet pre-heating, and curing profiles.

2. Automated System Optimization & Yield Enhancement

  • Maintain and optimize automated transfer and compression molding platforms (e.g., Towa, ASM, Fico systems).

  • Apply Statistical Process Control (SPC), Design of Experiments (DOE), and 8D Root Cause Analysis to drive process stability, Cpk improvements, and yield enhancement.

  • Qualify new EMC materials, mold chase designs, and release agents for new package conversions.




Requirements

  • Education: Bachelor’s Degree in Mechanical, Chemical, Materials Science, or Electronics Engineering.

  • Work Experience: 4 to 8 years of hands-on semiconductor manufacturing experience specializing in encapsulation and molding processes.

  • Domain Expertise: In-depth technical knowledge of Epoxy Molding Compound (EMC) properties and hands-on operation/troubleshooting of automated molding machinery (Towa, ASM, or Fico platforms).

  • Methodologies: Strong proficiency in SPC, DOE, 8D problem-solving, and FMEA frameworks.

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