- Yishun North Region (Singapore) Singapore
全职 Process Engineer - Back Grind - Saw 工作, 薪水 up to SGD 4,500, STATS ChipPAC Pte. Ltd. North Region (Singapore) 公司招聘中 - Ricebowl
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About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Support qualification & engineering builds for pre-assembly and customer builds from engineering to high volume production. All aspects of this job are NPI and Qual Engineering plant wide, affecting operations.
Key responsibilities
Coordinates with Operations to ensure that Engineering Builds are processed per requirement.
Perform customer evaluations and DOE & provide recommendation for improvements if necessary.
Ensures smooth transition of new products from Engineering Mode to High Volume Manufacturing.
Provide corrective actions & improvement plans for all issues observed during Engineering & Qualification builds.
What we're looking for
In-depth knowledge of Backgrind, Laser Groove & Wafer Saw process.
Preferably 3 years experience in Pre-Assembly process.
Good knowledge in SPC & Problem Solving Methodology.
Good communication skills.
Able to work beyond normal working hours if needed.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
Support qualification & engineering builds for pre-assembly and customer builds from engineering to high volume production. All aspects of this job are NPI and Qual Engineering plant wide, affecting operations.
Key responsibilities
Coordinates with Operations to ensure that Engineering Builds are processed per requirement.
Perform customer evaluations and DOE & provide recommendation for improvements if necessary.
Ensures smooth transition of new products from Engineering Mode to High Volume Manufacturing.
Provide corrective actions & improvement plans for all issues observed during Engineering & Qualification builds.
What we're looking for
In-depth knowledge of Backgrind, Laser Groove & Wafer Saw process.
Preferably 3 years experience in Pre-Assembly process.
Good knowledge in SPC & Problem Solving Methodology.
Good communication skills.
Able to work beyond normal working hours if needed.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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