Key Responsibilities
- Process Optimization & Control: Monitor and maintain electroplating baths, chemical parameters, temperature, and current densities to ensure optimal plating quality.
- Troubleshooting: Direct and resolve day-to-day technical issues on the plating line, investigating root causes for plating defects (e.g., pitting, blistering, uneven thickness, poor adhesion).
- Continuous Improvement (CI): Formulate and implement process improvement initiatives to enhance yield rates, reduce chemical consumption, and shorten cycle times.
- Documentation & Standard SOPs: Create, review, and update Standard Operating Procedures (SOPs), Work Instructions (WI), and process control parameters.
- New Product Introduction (NPI): Collaborate with the tooling and production teams to evaluate, set up, and validate new plating lines or new customer projects (PPAP, FAI process).
- Quality & Compliance: Ensure all plating processes comply with ISO 9001, ISO 14001, and environmental regulations (e.g., DOE/EIA requirements for wastewater treatment).
- Lab Liaison: Work closely with the chemical laboratory team to monitor bath analysis results and execute timely chemical dosing or bath carbon treatment/filtration.
Requirements & Qualifications
- Education: Bachelor’s Degree in Chemical Engineering, Chemistry, Materials Science, or a related engineering discipline.
- Experience: Minimum of 2–3 years of working experience in a plating house, surface finishing, or semiconductor/PCB manufacturing environment.
Pay: RM3,000.00 - RM4,000.00 per month
Benefits:
- Flexible schedule
- Maternity leave
Work Location: In person