全职 Engineer, CE PYE 工作, 薪水 up to SGD 5,000, MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Central Region (Singapore) 公司招聘中 - Ricebowl

Join the NAND Engineering Product Yield Enhancement (PYE) team as a Failure Analysis (FA) Engineer, providing Fault Isolation (FI) and Electrical Failure Analysis support for product qualifications and new device introductions. You will collaborate with Product, Process Integration, Test, and Quality teams to isolate electrical failures, identify physical defects, and support Micron’s latest NAND technologies.

Responsibilities

• Perform sophisticated electrical device characterization to determine electrical fail mechanisms.

• Operate fault isolation equipment to accurately narrow down failure defect locations.

• Establish and hypothesize potential electrical or process fail mechanisms based on detailed electrical fail models and physical failure analysis characterization, supporting process improvement.

• Collaborate closely with a diverse range of collaborators, including teams from frontend to backend and the Global Quality (GQ) department, to address and resolve defectivity issues.

• Prepare and present comprehensive electrical and physical failure mechanisms on a weekly basis to drive continuous improvement.

• Develop and implement new fault isolation and physical failure analysis techniques to stay ahead of industry standards.

• Coordinate the maintenance and high uptime of fault isolation and physical failure analysis tools to ensure world-class operational efficiency.

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Qualifications

• B.Sc. or higher in Electrical Engineering, Electronic Engineering, Microelectronics, Data Science or equivalent.

• Knowledge of memory technologies such as NAND, DRAM, or HBM is advantageous.

Technical Skills

• Experience in fault isolation equipment, techniques, and physical failure analysis is preferred.

• Physical failure analysis techniques and defect characterization methodologies. 

• Root cause analysis, yield improvement, and structured problem-solving approaches. 

Other Skills

• Flexibility to participate in planned shift rotations to support critical product qualifications, high-priority manufacturing events, and technology ramp activities.

• Data analysis, statistical interpretation, and familiarity with AI-enabled or data-driven engineering analysis tools. 

Soft Skills

• Structured analytical problem-solving. 

• Clear technical communication and presentation skills. 

• Cross-functional collaboration and stakeholder engagement. 

• Disciplined execution and attention to detail. 

• Learning agility and continuous improvement mindset. 

Embody Micron’s Core Values

• People – Respect, develop, and empower others 

• Innovation – Drive continuous improvement and breakthrough thinking 

• Tenacity – Show grit and determination 

• Collaboration – Build trust and foster teamwork 

• Customer Focus – Deliver excellence and value 

• Speed – Act with purpose and set the pace