全职 Lithography Engineer- Specialist-Senior Specialist 工作, 薪水 up to MYR 12,000, AGENSI PEKERJAAN VERSATILE RISING SDN BHD Kedah 公司招聘中 - Ricebowl

Job Responsibilities

• Develop, optimize and sustain DFR lamination, LDI, exposure/imaging and resist-development processes.
• Optimize resist thickness, uniformity, adhesion, exposure, development, imaging energy/speed, focus, alignment and registration.
• Establish robust process windows and recipes for fine-line/high-density products.
• Integrate lithography with resist development, etching, plating and subsequent processes.
• Establish process controls, CPPs and CTQs.
• Monitor SPC, Cp/Cpk, Pp/Ppk, process trends and defect Pareto.
• Use DOE and statistical tools to identify process variation and improvement opportunities.
• Reduce pattern, resist, registration, contamination and development defects, scrap and rework.
• Lead/support RCA and corrective actions using 8D, 5 Why, Fishbone, DOE, Fault Tree and statistical analysis.
• Work with Equipment Engineering and Maintenance on equipment performance, installation, commissioning and qualification.
• Support DFR laminator, LDI, development, inspection and metrology equipment requirements.
• Support NPI feasibility, engineering runs, pilot builds, process trials, DOE and qualification.
• Transfer R&D/TDI technology to production and conduct process-window and capability studies.
• Support PFMEA, Control Plans, quality investigations, audits and reliability reviews.
• Improve yield, capability, throughput, cycle time, utilization, defects, scrap/rework, material consumption and productivity.
• Support technology ramp-up and stable HVM, including excursions, yield deterioration, bottlenecks and new-line qualification.
• Maintain specifications, recipes, work instructions, control plans and qualification records.

Job Requirements

• Bachelor’s Degree or higher in Chemical, Materials, Mechanical, Electrical/Electronic, Manufacturing Engineering, Physics, Chemistry, Semiconductor/Microelectronics Engineering or related technical field.
• 3–8 years of relevant process-engineering experience.
• Experience in IC substrate, semiconductor, advanced PCB/HDI, advanced packaging, wafer fabrication, semiconductor assembly/test or electronics manufacturing preferred.
• Direct experience in lithography, imaging, patterning or fine-line processes highly desirable.
• HVM experience is an advantage.
• Strong knowledge of DFR lamination, LDI, lithography/imaging, resist development, exposure, pattern development, registration/alignment and fine-line/high-density pattern formation.
• Knowledge of SPC, process capability, DOE, qualification/validation, NPI, technology transfer and HVM stabilization.
• Hands-on experience with LDI systems, DFR laminators, resist-development systems, AOI/optical inspection and metrology.
• Experience with manufacturing data/MES and automated process-control systems.
• Strong problem-solving skills with 8D, 5 Why, Fishbone, DOE, RCA and CAPA/RCCA.
• Experience using JMP, Minitab or equivalent statistical tools.
• Able to work with R&D, TDI, NPI, Production, Quality, Equipment Engineering and Maintenance teams.
• Strong technical communication, documentation, presentation, teamwork and stakeholder-management skills.

Pay: RM6,000.00 - RM12,000.00 per month

Work Location: In person