Diploma or Degree in Mechanical Engineering or related Technical disciplines.
Minimum 3 years of design experiences in semiconductor machines or automations.
Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
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CAD software (e.g.
AutoCAD
SolidWorks
Inventor)
2D and 3D drafting
Geometric Dimensioning and Tolerancing (GD&T)
Mechanical design principles
Technical drawing interpretation
Collaboration with engineers and manufacturing teams
Manufacturing processes