Humana International Group Hiring! Full Time Senior process and equipment engineer (wirebond) in Negeri Sembilan - Ricebowl

Position: Senior Process and Equipment Engineer (Wirebond)

Location: Seremban, Negeri Sembilan

Employment Type: Full-time

About The Client

Our client is a global semiconductor company that designs and manufactures a broad portfolio of discrete components, power semiconductors, analog and logic ICs, serving customers across the automotive, industrial, mobile, consumer, and computing markets. The company focuses on delivering products with industry-leading efficiency, quality, and reliability while supporting a more sustainable future through responsible manufacturing and continuous technological advancement.

About the Role

This role is responsible in leading the development, qualification, optimization, and continuous improvement of wire bonding equipment and processes to achieve high manufacturing yield, quality, and reliability. This role is also responsible in troubleshooting equipment and process issues, analyze data to drive corrective actions, and support new product introductions through close collaboration with cross-functional teams. Besides that, this role ensures compliance with quality, safety, and environmental standards while maintaining process documentation, supporting internal and external audits, leading cost and productivity improvement projects, and mentoring junior engineers.

Job Description

• Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
• Develop and implement process improvements to enhance yield, reliability, and throughput. Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced production environment.
• Collaborate with design, quality, and manufacturing teams to support new product introductions.
• Analyze process data to identify trends and implement corrective or preventative actions.
• Mentor junior engineers and share best practices within the team.
• Ensure compliance with safety, quality, and environmental standards.
• Update FMEA, Control Plan, OCAP, SPC and other related documents for Equipment and Process.
• Internal and External audit.
• Cost / MVA project and other related project for Equipment and Process.
• Other activities assigned by superior.

Requirements

• Bachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper. Others wire type handling is a plus.
• Solid Hands-on experience in ASM wire bonders, bonder programming, and process optimization. KNS Hands-on experience is a plus.
• Solid analytical and problem-solving skills, with experience using data to drive decisions.
• Knowledge of semiconductor manufacturing standards, quality control, and reliability testing
• Statistical Knowledge/Hands-on in JMP, Minitab and/or other statistical tools.
• Excellent communication and collaboration skills; ability to work across teams.