Carsem Hiring! Full Time Head of FOL and EOL Engineering in Perak - Ricebowl

Position Summary

We are seeking an experienced and strategic Director / Head of FOL & EOL Engineering to lead semiconductor backend assembly engineering across Front-of-Line (FOL) and End-of-Line (EOL) operations. This role is responsible for driving engineering excellence, process optimization, technology deployment, yield improvement, and manufacturing support within a high-volume production environment.

The successful candidate will bring deep expertise in semiconductor backend assembly processes, advanced packaging technologies, and engineering leadership. This position plays a critical role in supporting business growth, customer satisfaction, operational efficiency, and the successful execution of technology roadmaps across multiple manufacturing lines and sites.

Key Responsibilities

Engineering Leadership

• Lead and manage FOL & EOL Engineering teams responsible for process development, optimization, and manufacturing support.
• Define and execute engineering strategies aligned with business objectives and technology roadmaps.
• Build and develop a high-performing engineering organization focused on innovation, quality, and continuous improvement.
• Provide technical leadership across multiple production lines and manufacturing sites.

Process Engineering & Manufacturing Support

• Drive process stability, capability improvement, and manufacturing efficiency across FOL and EOL operations.
• Lead engineering initiatives to improve yield, throughput, cycle time, quality, and cost performance.
• Ensure robust process controls and engineering standards are implemented and maintained.
• Support production ramp-ups, technology transfers, and new customer programs.

Advanced Packaging Technologies

• Lead engineering support for advanced semiconductor packaging technologies.
• Drive the introduction and qualification of new assembly processes, materials, and equipment.
• Collaborate with R&D, Product Engineering, Manufacturing, and Quality teams on technology deployment.
• Evaluate emerging packaging and assembly technologies to enhance competitive advantage.

Yield & Continuous Improvement

• Establish systematic yield improvement programs through data analysis and root cause investigation.
• Lead corrective and preventive action initiatives to address process-related issues.
• Drive Lean Manufacturing, Six Sigma, and operational excellence initiatives.
• Develop engineering solutions that improve productivity, quality, and cost performance.

Customer & Stakeholder Management

• Act as the key engineering interface for customers regarding process capability, quality, and technical requirements.
• Support customer audits, engineering reviews, and technical discussions.
• Work closely with cross-functional teams to ensure successful execution of customer programs.
• Ensure engineering readiness for customer technology and business requirements.

People Development

• Lead, mentor, and develop engineering managers, technical experts, and engineering teams.
• Strengthen engineering capabilities through training, coaching, and succession planning.
• Foster a culture of accountability, collaboration, innovation, and continuous learning.
• Promote employee engagement and high-performance leadership practices.

Qualifications

Education

• Bachelor's Degree in Engineering, Electronics, Mechanical Engineering, Materials Science, or a related field.
• Master's Degree is an added advantage.

Experience

• Minimum 15–20 years of semiconductor manufacturing experience.
• Minimum 8–10 years in engineering leadership or senior management roles.
• Strong experience in:
• Semiconductor backend assembly engineering
• FOL & EOL process engineering
• Advanced packaging technologies
• High-volume manufacturing environments
• Proven experience managing:
• Large engineering organizations
• Cross-functional engineering teams
• Multi-site or multi-line engineering operations
• Global customer engineering requirements