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Humana International Group Hiring! Full Time Senior Process Engineer in Negeri Sembilan - Ricebowl

Senior Process Engineer

Humana International Group

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Working Location

  • Seremban Negeri Sembilan Malaysia

Job Description

Responsibilities

Our client, A europe headquartered semiconductor manufacturing giant, is seeking a Senior Wire Bond Equipment & Process Engineer to join their dynamic team in Malaysia.


In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross-functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.


What You Will Do:

• Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and

processes.

• Develop and implement process improvements to enhance yield, reliability, and throughput.

• Troubleshoot, Disposition and resolve equipment and process issues in a fast-paced

production environment.

• Collaborate with design, quality, and manufacturing teams to support new product

introductions.

• Analyze process data to identify trends and implement corrective or preventative actions.

• Mentor junior engineers and share best practices within the team.

• Ensure compliance with safety, quality, and environmental standards.

• Update FMEA, Control Plan, OCAP, SPC and other related documents for Equipment and

Process.

• Internal and External audit.

• Cost / MVA project and other related project for Equipment and Process.

• Other activities assigned by superior.


QUALIFICATIONS

• Bachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials

Science, or a related field.

• Minimum 5 years of experience in wire bonding equipment and semiconductor process

engineering.

• Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and

Copper. Others wire type handling is a plus.

• Solid Hands-on experience in ASM wire bonders, bonder programming, and process

optimization. KNS Hands-on experience is a plus.

• Solid analytical and problem-solving skills, with experience using data to drive decisions.

• Knowledge of semiconductor manufacturing standards, quality control, and reliability testing

Statistical Knowledge / Hands-on in JMP, Minitab and/or other statistical tools.

• Excellent communication and collaboration skills; ability to work across teams.

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