Nexperia Hiring! Full Time Package Development Senior Manager in Negeri Sembilan - Ricebowl

Leads the strategic definition and execution of package platform and backend assembly technology roadmaps, ensuring alignment with business objectives and product innovation needs. Drives the development and qualification of assembly packaging solutions from concept to mass production. Supports teams to achieve project goals by clearing technical roadblocks. Accountable for delivering reliable, manufacturable, and cost‑effective package solutions, while influencing key technology decisions and enabling competitive advantage. Acts as a technical leader, ensuring strong cross‑functional collaboration, driving continuous improvement, and identifying future‑ready assembly technologies to sustain long‑term growth. Ensures good communication and stakeholder management. Coaches and develops the team’s technical competence and career growth.

Bachelor’s or Master’s degree in Engineering.

At least 10 years of relevant experience in the semiconductor industry, with a minimum of 3 years in a managerial capacity.

Comprehensive knowledge of assembly process, BOM, design, and equipment technologies related to semiconductor packaging.

• Package design rule review
• Thermal and stress FEA simulation
• DFMEA, PFMEA
• DFx (DFM, DFA, DFR)
• AutoCAD
• Root cause analysis
• DFPC
• Analytical tools
• Strong leadership and ability to coach others
• Continuous learning and sharing within the organization
• Keeping up‑to‑date with state‑of‑the‑art packaging, material and process developments

As an equal‑opportunity employer, we value diversity because diverse teams perform better. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, provide a safe work environment and reasonable adjustments where requested. We provide the opportunity to join employee resource groups such as Pride Network or Women’s groups.