Unisem (M) Berhad Hiring! Full Time Process Engineer (Flip Chip - Mold -Backgrind - Wafer Saw) in Perak - Ricebowl

Company Description

Unisem is a global provider of semiconductor assembly and test (OSAT) services for leading electronics companies. We offer packaging and test services such as wafer bumping, wafer probing, wafer grinding, and a range of leadframe and substrate IC packaging. Our manufacturing sites are located in Simpang Pulai and Gopeng, Perak, as well as Chengdu, China.

Role Description:

• Provide technical support and effective solutions to resolve critical issues in the assembly line.
• Ensure all processes are executed in full compliance with Standard Operating Procedures (SOPs).
• Monitor and analyze performance at QA gates, SPC trends, and yield results to maintain process stability and quality.
• Drive process optimization and continuous improvement through Design of Experiments (DOE) and machine capability studies.
• Perform verification and detailed analysis on defective parts to identify root causes and implement corrective and preventive actions.
• Preferably possess experience in Flip Chip / SMT /Backgrind / Wafer Saw / Wafer AOI processes.

Qualifications:

• Bachelor’s Degree in Electronics, Mechanical, Mechatronics, Manufacturing, or a related field.
• Preferably with experience in the semiconductor industry or with similar job responsibilities.
• Knowledge of DOE, SPC, and quality tools will be an advantage.
• Independent, self-motivated, and able to work with minimal supervision.
• Strong analytical, communication, and interpersonal skills.
• Fluent in spoken and written English.
• Proficiency in Mandarin will be an added advantage to liaise with respective customers.
• Work location: Simpang Pulai or Gopeng, Perak.

Benefits:

• Free parking
• Opportunities for promotion
• Professional development

Work Location: In person