NCS Global Technology Hiring! Full Time Failure Analysis Engineer (Packaging Focus) in Pulau Pinang, Earn up to MYR 3,600 - Ricebowl

Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.

Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.

Strong analytical thinking and problem-solving skills.

Familiarity with material analysis techniquessuch asFTIR, XPS, and ToF-SIMS is an advantage.

Perform electrical validation and fault isolation on failed products.

Identify and analyze physical defects related to electrical failures.

Evaluate assembly, fabrication, and substrate processes to determine root causes of failure.

Assess material properties and mechanical characteristics of components for defect analysis.

Use analytical tools such as

• Parametric Analyzer (I/V analysis), Keithley Meter, TDR, EOTPR

• SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, IRLC

• Mechanical & chemical sample preparation

Interpret results to understand failure modes and mechanisms.

Prepare and publish analytical reports with root cause findings and corrective action recommendations.

Review failure reports and propose actions to prevent recurrence.

Develop analytical methods and metrology solutions for new package technologies.

Support new package transfers and share best-known methods with Assembly Test Manufacturing (ATM) sites.