6份Application Engineering 工作机会 - 最新工作招聘 - October 2026
显示6个工作的结果
"application engineering"
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago
SGD2,500 - SGD5,000 每月
Singapore, Singapore
- Diploma or Degree in Mechanical Engineering or related Technical disciplines.
- Minimum 3 years of design experiences in semiconductor machines or automations.
- Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
Posted
2 months ago