6份Application Engineering工作在Singapore - October 2026

显示6个工作的结果 "application engineering" 在 Singapore
不要错过任何 Application Engineering 的新工作机会 在 Singapore
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago
SGD2,500 - SGD5,000 每月

Singapore, Singapore

  • Diploma or Degree in Mechanical Engineering or related Technical disciplines.
  • Minimum 3 years of design experiences in semiconductor machines or automations.
  • Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus. ...
CAD software (e.g. AutoCAD
+8
Posted
2 months ago

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