全职 Process - Equipment Engineer – Encapsulation (ASMPT-Asymentek) 工作, 薪水 up to MYR 7,000, Globetronics Pulau Pinang 公司招聘中 - Ricebowl

Process Engineer – Encapsulation (ASMPT/Asymentek)

Location: Bayan Lepas, Penang, Malaysia
Employment Type: Permanent | Full-Time

Job Summary

We are looking for a highly motivated Process Engineer with hands-on experience in Encapsulation processes using ASMPT/Asymentek dispensing equipment. The successful candidate will be responsible for developing, optimizing, and sustaining semiconductor assembly processes to achieve high product quality, manufacturing efficiency, and yield. You will work closely with Production, Equipment, Quality, and New Product Introduction (NPI) teams to troubleshoot process issues, support new product launches, and drive continuous improvement initiatives.

Key Responsibilities

• Develop, optimize, and sustain encapsulation and dispensing processes for semiconductor manufacturing.
• Set up, program, and optimize ASMPT/Asymentek dispensing equipment and process parameters.
• Troubleshoot process and equipment issues using root cause analysis and implement corrective and preventive actions.
• Support New Product Introduction (NPI), process qualification, and production ramp-up.
• Monitor process capability and analyze manufacturing data to improve yield, quality, and productivity.
• Work closely with cross-functional teams to resolve production and quality issues.
• Prepare and maintain process documentation, work instructions, FMEA, and Control Plans.
• Drive continuous improvement projects using Lean Manufacturing, SPC, DOE, and Six Sigma methodologies.
• Ensure compliance with safety, quality, and customer requirements.

Requirements

• Bachelor's Degree in Electronics, Electrical, Mechanical, Manufacturing, Mechatronics, Materials Engineering, or a related discipline.
• Minimum 2–5 years of experience in the semiconductor or electronics manufacturing industry.
• Hands-on experience with ASMPT/Asymentek dispensing machines.
• Experience in encapsulation, underfill, glob top, dam & fill, or epoxy dispensing processes is highly preferred.
• Strong analytical, troubleshooting, and problem-solving skills.
• Knowledge of SPC, DOE, PFMEA, 8D, and Lean Manufacturing is an advantage.
• Good communication skills and ability to work effectively in a cross-functional team.

Preferred Skills

• ASMPT/Asymentek Dispensing Systems
• Encapsulation Process
• Underfill
• Glob Top
• Dam & Fill
• Epoxy Dispensing
• Process Development & Optimization
• NPI (New Product Introduction)
• Yield Improvement
• SPC, DOE, PFMEA, 8D
• Root Cause Analysis (RCA)
• Semiconductor Packaging
• Continuous Improvement

Job Type: Full-time

Pay: RM5,500.00 - RM7,000.00 per month

Benefits:

• Additional leave
• Dental insurance
• Flexible schedule
• Free parking
• Health insurance
• Maternity leave
• Opportunities for promotion
• Parental leave
• Professional development

Work Location: In person