全职 Principal Engineer Technology Excellence 工作, 薪水, Infineon Technologies Melaka 公司招聘中 - Ricebowl

As technical expert, you work in the field of interaction of wafer technology (chip frontside metallization) and frontside interconnect ( wire bond, clip bond). You are part of FE-BE predevelopment and optimization teams, so that you can actively participate in the FE-BE strategy definition.

Your role

Key responsibilities in your new role

• Apply your technical knowledge within own optimization projects or as project team member of development projects with FE-BE and platform overarching impact.
• Ensure cost effective production by fostering reuse and avoiding complexity before production release.
• Act as an entrepreneur and technical leader in the area of innovation& implementation (leading as expert, generate & file inventions).
• Closely cooperate with worldwide Infineon wafer fab and backend sites.
• Drive & define the process guideline documentation out of lessons learnt for interaction between chip and assembly.
• Share the know-how concerning process block interactions as trainer.
  
  

Your profile

Qualifications And Skills To Help You Succeed

• Bachelor’s or master’s degree in engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Expertise across different wafer and assembly technologies, e.g. chip metallization, wire bond, solder paste and sintering techniques, and their process interactions.
• Good communication skills to interact with cross-site technical teams.
• Ability to simplify complex technical interactions to enable decision-making.
• Experience in failure analysis, statistical data analysis, design of experiment, and problem-solving methods (8D, 6-sigma).
• Infineon on-site training regarding wafer technology as well as assembly processes can be provided.
  
  

#WeAreIn for driving decarbonization and digitalization.

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