- Singapore Singapore
全职 Wire Bond Process Engineer 工作, 薪水 up to SGD 8,000, ACCTON TECHNOLOGY SG PTE. LTD. 公司招聘中 - Ricebowl
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职位描述
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Position Summary
The Wire Bond Process Engineer is responsible for developing, sustaining, and improving wire bonding processes for optical transceiver products. The role involves equipment optimization, process development, yield improvement, NPI support, and manufacturing problem resolution.
Qualifications
Education
Bachelor's degree or above in Mechanical Engineering, Electronics Engineering, Manufacturing Engineering, Materials Science, or a related discipline.
Experience
5+ years of hands-on wire bonding experience in semiconductor packaging or optoelectronics manufacturing.
Experience in high-volume manufacturing is preferred.
Technical Skills
Strong understanding of wire bonding processes and bonding fundamentals.
Hands-on experience with Wire Bonder platforms such as:
K&S (Kulicke & Soffa)
ASM
or equivalent equipment
Experience with:
Bond parameter optimization
Recipe development
Bond program creation
Equipment troubleshooting
Knowledge of gold, copper, and aluminum wire bonding technologies.
Familiarity with semiconductor packaging materials and assembly processes.
Experience with process characterization, SPC, DOE, and yield analysis.
Understanding of wire pull testing and bond quality inspection methods.
Soft Skills
Strong analytical and troubleshooting capabilities.
Good communication and teamwork skills.
Data-driven decision-making and reporting abilities.
Key Responsibilities
Develop, qualify, and optimize Wire Bond manufacturing processes.
Create, validate, and maintain bonding programs and machine recipes.
Improve manufacturing performance through:
Yield enhancement
Process stability improvement
Cycle time reduction
Defect reduction
Perform process characterization and capability studies.
Analyze bond quality issues and implement corrective actions.
Support NPI activities, process transfer, and engineering builds.
Collaborate with Die Attach, Active Alignment, Test, Quality, and Manufacturing teams to improve overall assembly performance.
Conduct root cause investigations using structured problem-solving methodologies.
Support equipment maintenance, calibration, and qualification activities.
Develop and update SOPs, Work Instructions, process specifications, and training documentation.
Monitorkey process indicators and drive continuous improvement initiatives.
A leader in advanced technologies of hyperscale datacenters, AI, and edge computing.
Accton drives global networking innovation,delivering cutting-edge solutions as an ODM through JDM partnerships
The Wire Bond Process Engineer is responsible for developing, sustaining, and improving wire bonding processes for optical transceiver products. The role involves equipment optimization, process development, yield improvement, NPI support, and manufacturing problem resolution.
Qualifications
Education
Bachelor's degree or above in Mechanical Engineering, Electronics Engineering, Manufacturing Engineering, Materials Science, or a related discipline.
Experience
5+ years of hands-on wire bonding experience in semiconductor packaging or optoelectronics manufacturing.
Experience in high-volume manufacturing is preferred.
Technical Skills
Strong understanding of wire bonding processes and bonding fundamentals.
Hands-on experience with Wire Bonder platforms such as:
K&S (Kulicke & Soffa)
ASM
or equivalent equipment
Experience with:
Bond parameter optimization
Recipe development
Bond program creation
Equipment troubleshooting
Knowledge of gold, copper, and aluminum wire bonding technologies.
Familiarity with semiconductor packaging materials and assembly processes.
Experience with process characterization, SPC, DOE, and yield analysis.
Understanding of wire pull testing and bond quality inspection methods.
Soft Skills
Strong analytical and troubleshooting capabilities.
Good communication and teamwork skills.
Data-driven decision-making and reporting abilities.
Key Responsibilities
Develop, qualify, and optimize Wire Bond manufacturing processes.
Create, validate, and maintain bonding programs and machine recipes.
Improve manufacturing performance through:
Yield enhancement
Process stability improvement
Cycle time reduction
Defect reduction
Perform process characterization and capability studies.
Analyze bond quality issues and implement corrective actions.
Support NPI activities, process transfer, and engineering builds.
Collaborate with Die Attach, Active Alignment, Test, Quality, and Manufacturing teams to improve overall assembly performance.
Conduct root cause investigations using structured problem-solving methodologies.
Support equipment maintenance, calibration, and qualification activities.
Develop and update SOPs, Work Instructions, process specifications, and training documentation.
Monitorkey process indicators and drive continuous improvement initiatives.
A leader in advanced technologies of hyperscale datacenters, AI, and edge computing.
Accton drives global networking innovation,delivering cutting-edge solutions as an ODM through JDM partnerships
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