Job Responsibilities
Support process development activities to optimize customer applications
Conduct in-house application test cuts and provide on-site customer technical support
Manage and resolve customer claims related to abrasive products
Communicate regularly with engineers from Japan to coordinate technical solutions
Participate actively in company-organized activities to foster team engagement
Promote and maintain positive interdepartmental relationships to enhance collaboration
Establish and sustain strong relationships with customers to ensure satisfaction and repeat business
Preferred competencies and qualifications
Knowledge or experience with Dicer, Grinder, or Laser technologies
Strong technical understanding of blades, wheels, and laser support
Diploma in Mechanical, Electronic, or other engineering disciplines
1 to 2 years of relevant experience, preferably in the semiconductor industry
Proficiency in MS Office applications, including PowerPoint and Excel
Willingness to travel and work extended hours as needed
Proactive attitude with strong people and team orientation
DISCO HI-TEC (SINGAPORE) PTE LTD
With our niche profile in the semiconductor and electronics industries, Disco Corporation, a Japanese MNC is one of the world's leading providers of advanced abrasive tools and precision equipments. Our corporation comprises of affiliate offices located throughout Japan, Europe, Asia and USA.