全职 Supervisor, Technical Training 工作, 薪水 up to SGD 7,000, SILICON BOX PTE. LTD. East Region (Singapore) 公司招聘中 - Ricebowl

Role: Training Supervisor in Semiconductor Manufacturing

Position Summary

The Training Supervisor will identify and monitor training needs in the organization, and design, plan, and implement training programs, policies, and procedures to fulfill those needs.

Candidates with experience in technical training in a fast-paced semiconductor manufacturing environment are encouraged to apply for this position.

Key Responsibilities:
Reviews existing production training programs, suggests enhancements and modifications to improve engagement, learning, and retention and/or to meet the changing needs of the organization or industry.

Ensures that training materials and programs are current, accurate, and effective.

Maintains knowledge of new methods and techniques for training, and training requirements applicable to the organization and/or industry.

Identifies problems and opportunities such as operational changes or industry developments that training could improve.

Conducts or facilitates required and recommended training sessions.

Collaborates with vendors and third-party training providers to arrange employee registration for and participation in outside training programs.

Ensures that training milestones and goals are met while adhering to the approved training budget.

Prepares and implements training budget.

Performs other related duties as assigned.

Requirements:
At least five years of experience in training, with at least one year of supervisory experience in the semiconductor industry.

Bachelor’s degree in any engineering discipline or related field required.

Positive and can-do attitude, with a willingness to accept challenges.

Excellent verbal and written communication skills, with the ability to conduct classes for large groups of employees.

Thorough understanding of wafer-level training processes.
Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.

We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.