全职 NPI Engineer - Test Process (WLCSP) 工作, 薪水 up to SGD 4,500, ASE SINGAPORE PTE. LTD. North Region (Singapore) 公司招聘中 - Ricebowl

Responsibilities

Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting

Monitor and improve device yield performance and process SPC charts

Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots

Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc

Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management

Facilitate training of manufacturing personnel on operating procedures and process specification

Work closely with inter-department to improve process and equipment performance and capability

Coordinate and communicate with customers for any process engineering related matters

Setup systems and NPI requirements, handles qualifications and engineering activities

Requirements

Diploma / Degree in any Engineering Discipline

Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage

Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification

Clear and effective communication with customers, suppliers and cross department

Able to multi-task and support ad-hoc projects in process and equipment related activities

Entry level candidates are welcome to apply
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.