- Yishun North Region (Singapore) Singapore
全职 Process Integration Manager 工作, 薪水 up to SGD 8,500, STATS CHIPPAC MANAGEMENT PTE. LTD. North Region (Singapore) 公司招聘中 - Ricebowl
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About the role
The Process Integration team is focused on the incorporation of all processes in manufacturing for high yield and best quality/CT eWLB products. This position reports to Director, Process Engineering and oversees Process Engineer and Process Associate Engineer roles.
Key responsibilities
Work closely with AOI/process/equipment engineering team to swiftly contain high Defect Density and inline excursions and find root causes and provide working solutions to satisfy customer quality
Review unresolved requests for adjustment of complaints and read customer comments to determine basis of complaint and plan of action needed to resolve complaint
Drive process improvement plan based on systematic analysis of inline/Electrical Test/yield data to meet quality and yield targets
Identify key process weaknesses and perform fine tuning on existing processes for continuous improvement to yield/quality/productivity and cost
Use statistical knowledge (e.g. DOE, SPC) and systematic problem-solving techniques (e.g. 8D, 5 Whys) to determine root causes for low yield wafers/lots as well as developing containment/corrective/preventive action plans
Lead process control plan update and customer audit
Support new Process/Product qualification from product design through to LVM completion
About you
Degree in Physics, Chemistry, Material Science, Mechanical/Chemical/Electrical Engineering or equivalent
5 to 10 years of relevant experience in wafer bumping, wafer fabrication or packaging
Strong knowledge in process integration scheme/ process stability and yield enhancement activities
The Process Integration team is focused on the incorporation of all processes in manufacturing for high yield and best quality/CT eWLB products. This position reports to Director, Process Engineering and oversees Process Engineer and Process Associate Engineer roles.
Key responsibilities
Work closely with AOI/process/equipment engineering team to swiftly contain high Defect Density and inline excursions and find root causes and provide working solutions to satisfy customer quality
Review unresolved requests for adjustment of complaints and read customer comments to determine basis of complaint and plan of action needed to resolve complaint
Drive process improvement plan based on systematic analysis of inline/Electrical Test/yield data to meet quality and yield targets
Identify key process weaknesses and perform fine tuning on existing processes for continuous improvement to yield/quality/productivity and cost
Use statistical knowledge (e.g. DOE, SPC) and systematic problem-solving techniques (e.g. 8D, 5 Whys) to determine root causes for low yield wafers/lots as well as developing containment/corrective/preventive action plans
Lead process control plan update and customer audit
Support new Process/Product qualification from product design through to LVM completion
About you
Degree in Physics, Chemistry, Material Science, Mechanical/Chemical/Electrical Engineering or equivalent
5 to 10 years of relevant experience in wafer bumping, wafer fabrication or packaging
Strong knowledge in process integration scheme/ process stability and yield enhancement activities
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