全职 Semiconductor Assembly - Process Technician – FOL - Dicing - Encapsulation 工作, 薪水, Globetronics Technology Berhad Pulau Pinang 公司招聘中 - Ricebowl

About the role

We are seeking an experienced Semiconductor Assembly & Process Technician with hands-on experience in Pick & Place, Dicing, FOL Assembly, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation processes. The successful candidate will support daily production, equipment setup, process troubleshooting, product changeover, and process improvement to ensure stable and efficient semiconductor manufacturing operations.

Key responsibilities

• Operate, set up, and monitor semiconductor assembly and manufacturing equipment according to SOPs and work instructions.

• Perform hands-on processes including Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.

• Support FOL (Front-of-Line) assembly processes and ensure production targets and quality requirements are achieved.

• Perform equipment setup, product changeover, recipe verification, and parameter checks.

• Troubleshoot process and equipment abnormalities and escalate issues to Engineers when required.

• Perform basic equipment adjustments and support preventive maintenance activities.

• Monitor process parameters, machine performance, product quality, and production output.

• Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly-related issues.

• Support engineering trials, NPI, process qualification, product transfer, and improvement activities.

• Maintain accurate production, process, and equipment records.

About you

• Minimum SPM / Certificate / Diploma in Engineering, Electronics, Mechanical, Mechatronics, Manufacturing, or related field.

• 1–5 years of hands-on experience in semiconductor, electronics, or manufacturing industry.

• Practical experience in one or more of the following processes: Pick & Place, Dicing / Wafer Sawing, FOL Assembly, Die Bonder, DA & Recon, Curing / Cure, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, Encapsulation.

• Experience with Asymtek / dispensing or encapsulation equipment is an added advantage.

• Good understanding of semiconductor assembly processes and equipment operation.

• Able to perform basic machine troubleshooting and process adjustments.

• Willing to work in a cleanroom and shift environment.

• Good teamwork, discipline, attention to detail, and problem-solving skills.