全职 Process Technician (Dicing-Mask Alignment) 工作, 薪水 up to SGD 3,500, TECNISCO ADVANCED MATERIALS PTE. LTD. 公司招聘中 - Ricebowl

Key Responsibilities:
Operate wafer dicing machines to cut wafers into individual dies according to specifications

Perform mask alignment processes using mask aligner equipment for photolithography

Load and unload wafers, masks, and related materials safely and accurately

Set up machine parameters (alignment, cutting depth, speed, exposure settings, etc.)

Conduct routine inspection of wafers and dies to ensure quality standards are met

Monitor process performance and report any abnormalities or defects

Perform basic troubleshooting and preventive maintenance on equipment

Maintain cleanroom discipline and comply with EHS (Environment, Health & Safety) requirements

Record production data, process parameters, and inspection results accurately

Support engineers in process improvement and yield enhancement activities

Requirements:
Diploma / NITEC in Engineering, Semiconductor Technology, or related field

Minimum 1–3 years of experience in semiconductor manufacturing (dicing or photolithography preferred)

Familiar with dicing saw and mask aligner equipment

Ability to read and follow technical work instructions and drawings

Basic understanding of cleanroom protocols and wafer handling

Good attention to detail and quality awareness

Able to work in a cleanroom environment and shift work (if required)

Tecnisco Advanced Materials Pte. Ltd.

, part of the

Tecnisco Corporate Group

, is a Singapore-based advanced materials company focused on the development, manufacturing, and application of high-performance materials and precision components for semiconductor, laser, data centre, and advanced engineering applications.

Leveraging the Tecnisco Group’s established engineering expertise, manufacturing experience, and global customer base, Tecnisco Advanced Materials serves as a platform for advanced materials development and localized manufacturing in Singapore. The company supports customers across the full product lifecycle, from early-stage research and development through prototyping, process qualification, and volume production.

A key focus area of Tecnisco Advanced Materials is

thermal management materials

addressing increasing heat dissipation challenges in semiconductor equipment, advanced packaging, laser systems, and data centre infrastructure. These applications require materials with high thermal conductivity, dimensional stability, mechanical strength, and long-term reliability under demanding operating conditions. The company develops material systems engineered to meet stringent thermal, mechanical, and quality requirements driven by next-generation semiconductor and AI-enabled computing platforms.

Core technical capabilities include

metal infiltration

,

waterjet cutting

, and

precision manufacturing processes

tailored for advanced material systems. These capabilities enable the production of complex geometries and high-performance components with tight dimensional control and consistent material properties. Process optimization, yield improvement, and root-cause analysis are integral to operations, supporting stable and repeatable manufacturing outcomes aligned with customer specifications.

Tecnisco Advanced Materials provides

end-to-end new product development (NPD) support

, including material selection, design-for-manufacturability review, prototyping, testing, validation, and transition to production. The company works closely with customers to shorten development cycles, mitigate technical risks, and accelerate time-to-market, particularly for new semiconductor equipment platforms and emerging technology applications.

Quality, reliability, and operational discipline are central to the company’s manufacturing approach. Processes are designed to meet demanding industry standards for consistency, traceability, and performance, supporting customers’ requirements for high yield, uptime, and product reliability. Continuous improvement initiatives are embedded to enhance process capability, productivity, and cost efficiency.

As part of the Tecnisco Corporate Group, Tecnisco Advanced Materials benefits from shared technical resources, engineering know-how, and access to international markets. The company aims to strengthen Singapore’s advanced manufacturing ecosystem by expanding thermal management material capabilities, supporting semiconductor and data centre growth, and anchoring high-value engineering and manufacturing activities locally.