全职 R-D Manager - Frontend-Backend 工作, 薪水 up to MYR 20,000, Executive Compass Kedah 公司招聘中 - Ricebowl

Key Responsibilities

• Lead and manage the development engineering team, including technology development, process development and industrialization activities.
• Drive the development and industrialization of new IC substrate products,technologies, materials, equipment and manufacturing processes.
• Lead technology transfer from R&D / other sites into the Malaysia manufacturing site.
• Define and execute technology roadmaps in alignment with customer requirements and business objectives.
• Manage NPI, technology qualification and product/process ramp-up activities.
• Ensure projects are delivered according to agreed timelines, quality requirements, technical specifications and cost targets.
• Lead cross-functional teams to resolve technical, process and manufacturing issues during NPI and production ramp-up.
• Work closely with customers on technical requirements, product specifications, qualification plans and technical reviews.
• Coordinate with suppliers and internal engineering teams on new materials, equipment and process technologies.
• Identify technology gaps and establish action plans to close gaps against customer and product requirements.
• Drive process capability, yield improvement, reliability and manufacturing robustness during industrialization.
• Establish and monitor key technology and engineering KPIs.
• Lead root-cause analysis and corrective actions for complex technical/process issues.
• Ensure proper documentation of process parameters, specifications, qualification results and engineering standards.
• Support customer audits, technical reviews and qualification activities.

Candidate Requirements

• Bachelor's or Master's Degree in Electrical Engineering, Electronics, Mechanical Engineering, Materials Science, Chemical Engineering, Manufacturing Engineering, Semiconductor Engineering or a related discipline.
• Minimum 10+ years of relevant experience in semiconductor, IC substrate, PCB, advanced packaging or high-tech electronics manufacturing.
• At least 3–5 years in a managerial / leadership position managing engineering or technology development teams.
• Strong experience in technology development, process development, NPI and industrialization.
• Experience with IC substrates, PCB, semiconductor is highly preferred.

Pay: RM12,000.00 - RM20,000.00 per month

Benefits:

• Dental insurance
• Health insurance
• Opportunities for promotion
• Parental leave
• Professional development

Work Location: In person