- Singapore Singapore
全职 Technical Program Manager 工作, 薪水 up to SGD 11,000, ACCTON TECHNOLOGY SG PTE. LTD. 公司招聘中 - Ricebowl
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Position Summary
The Technical Program Manager (TPM) is responsible for leading, coordinating, and executing multi-disciplinary engineering programs for optical transceiver and datacom product lines withinthe manufacturing facility. This role focuses on driving New Product Introduction (NPI), factory bring-up activities, cross-functional execution,process optimization, and technical risk mitigation from prototype stagesthrough to high-volume manufacturing. A strong technical grounding in coreoptical assembly processes is essential to effectively guide cross-functionalteams and resolve factory bottlenecks.
Qualifications
Education
Bachelor's degree or above in Optical Engineering, Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, or a related technical discipline.
Experience
7+ years of experience in technical program management, engineering management, or technical project leadership in optical transceiver, datacom, or optoelectronics manufacturing environments.
In-depth understanding of core optical transceiver assembly processes, specifically Die Bonding, Wire Bonding, and Active Alignment, including their impact on device performance, yield, and throughput.
Strong understanding of optical transceiver manufacturing processes, hardware validation, optical/electrical testing, and packaging workflows.
Ability to translate complex optical, electrical, and firmware specifications into actionable manufacturing requirements and production milestones.
Deep knowledge of New Product Introduction (NPI) frameworks, phase-gate development methodologies, and engineering change management (ECOs/ECNs).
Familiarity with qualification standards, manufacturing quality frameworks, statistical process control (SPC), and root cause analysis methodologies (DOE, FMEA, PFMEA, CAPA).
Strong capability in dependency mapping, risk management, and resource allocation across hardware, software, and test engineering disciplines.
Soft Skills
Exceptional cross-functional leadership, communication, and stakeholder management abilities.
Strong analytical, data-driven decision-making, and problem-solving skills.
Proficient in project management tools, Gantt charts, Microsoft Excel, and PowerPoint.
Ability to drive execution and maintain alignment in a fast-paced, high-tech manufacturing environment.
Key Responsibilities
Factory Bring-Up & NPI Program Execution:
Lead the technical program lifecycle for introducing new optical transceivers and datacom products into the manufacturing facility, coordinating milestones between product design, process engineering, and production teams from prototype to high-volume manufacturing (HVM).
Core Assembly & Process Integration:
Leverage a deep working knowledge of critical transceiver packaging processes—including Die Bonding, Wire Bonding, and Active Alignment—to partner directly with engineering teams, translate technical specs into robust manufacturing flows, and ensure seamless NPI handoffs to the factory floor.
Yield Optimization & Supply Chain Risk Management:
Proactively track and mitigate cross-functional risks impacting production timelines, such as component shortages (lasers, photodetectors, ICs) or equipment delays, collaborating with quality and engineering teams to address technical bottlenecks, improve first-pass yield (FPY), and drive root-cause analysis on manufacturing failures.
Process Optimization:
Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking (e.g., velocity, quality, capacity, manufacturing yield), championing operational excellence through standardization across all participating design, test, and production teams.
Cross-Functional Governance & Alignment:
Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress, critical risks, and resource requirements to executive leadership.
Compliance & Validation:
Oversee qualification cycles, ensuring alignment with industry standards (e.g., Telcordia, MSA specifications) while maintaining compliance with quality, safety, and operational governance standards across the factory floor.
A leader in advanced technologies of hyperscale datacenters, AI, and edge computing.
Accton drives global networking innovation,delivering cutting-edge solutions as an ODM through JDM partnerships
The Technical Program Manager (TPM) is responsible for leading, coordinating, and executing multi-disciplinary engineering programs for optical transceiver and datacom product lines withinthe manufacturing facility. This role focuses on driving New Product Introduction (NPI), factory bring-up activities, cross-functional execution,process optimization, and technical risk mitigation from prototype stagesthrough to high-volume manufacturing. A strong technical grounding in coreoptical assembly processes is essential to effectively guide cross-functionalteams and resolve factory bottlenecks.
Qualifications
Education
Bachelor's degree or above in Optical Engineering, Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, or a related technical discipline.
Experience
7+ years of experience in technical program management, engineering management, or technical project leadership in optical transceiver, datacom, or optoelectronics manufacturing environments.
- Proven track record of managing NPI, product transfers, or factory bring-up initiatives in high-volume manufacturing environments.
In-depth understanding of core optical transceiver assembly processes, specifically Die Bonding, Wire Bonding, and Active Alignment, including their impact on device performance, yield, and throughput.
Strong understanding of optical transceiver manufacturing processes, hardware validation, optical/electrical testing, and packaging workflows.
Ability to translate complex optical, electrical, and firmware specifications into actionable manufacturing requirements and production milestones.
Deep knowledge of New Product Introduction (NPI) frameworks, phase-gate development methodologies, and engineering change management (ECOs/ECNs).
Familiarity with qualification standards, manufacturing quality frameworks, statistical process control (SPC), and root cause analysis methodologies (DOE, FMEA, PFMEA, CAPA).
Strong capability in dependency mapping, risk management, and resource allocation across hardware, software, and test engineering disciplines.
Soft Skills
Exceptional cross-functional leadership, communication, and stakeholder management abilities.
Strong analytical, data-driven decision-making, and problem-solving skills.
Proficient in project management tools, Gantt charts, Microsoft Excel, and PowerPoint.
Ability to drive execution and maintain alignment in a fast-paced, high-tech manufacturing environment.
Key Responsibilities
Factory Bring-Up & NPI Program Execution:
Lead the technical program lifecycle for introducing new optical transceivers and datacom products into the manufacturing facility, coordinating milestones between product design, process engineering, and production teams from prototype to high-volume manufacturing (HVM).
Core Assembly & Process Integration:
Leverage a deep working knowledge of critical transceiver packaging processes—including Die Bonding, Wire Bonding, and Active Alignment—to partner directly with engineering teams, translate technical specs into robust manufacturing flows, and ensure seamless NPI handoffs to the factory floor.
Yield Optimization & Supply Chain Risk Management:
Proactively track and mitigate cross-functional risks impacting production timelines, such as component shortages (lasers, photodetectors, ICs) or equipment delays, collaborating with quality and engineering teams to address technical bottlenecks, improve first-pass yield (FPY), and drive root-cause analysis on manufacturing failures.
Process Optimization:
Define, implement, and continuously improve engineering development processes, communication frameworks, and metrics tracking (e.g., velocity, quality, capacity, manufacturing yield), championing operational excellence through standardization across all participating design, test, and production teams.
Cross-Functional Governance & Alignment:
Manage cross-team dependencies, facilitate technical trade-off decisions under constraint, and maintain program dashboards to communicate timeline progress, critical risks, and resource requirements to executive leadership.
Compliance & Validation:
Oversee qualification cycles, ensuring alignment with industry standards (e.g., Telcordia, MSA specifications) while maintaining compliance with quality, safety, and operational governance standards across the factory floor.
A leader in advanced technologies of hyperscale datacenters, AI, and edge computing.
Accton drives global networking innovation,delivering cutting-edge solutions as an ODM through JDM partnerships
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