- Singapore Singapore
全职 Product Engineer Technology Development 工作, 薪水 up to SGD 6,500, ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD. 公司招聘中 - Ricebowl
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Responsibilities
The Product Engineer (PE) / First Article Inspection Engineer (FAI) serves as a key technical interface between Design Engineering, Manufacturing, Process Engineering, Quality, and customer requirements. The role is responsible for driving product bring-up, New Product Introduction (NPI), FAI, manufacturing readiness, yield improvement, failure analysis, and continuous improvement throughout the product lifecycle—from initial product introduction through mass production and end-of-life.
The ideal candidate has strong experience in product engineering and semiconductor/electronics manufacturing, with hands-on knowledge of PCB/substrate fabrication, electrical and mechanical performance, manufacturing processes, statistical data analysis, yield improvement, and failure analysis.
1. Product Ownership & Manufacturing Excellence
Lead end-to-end ownership of assigned products throughout the product lifecycle, from design, NPI, and FAI through mass production and end-of-life.
Drive and monitor product performance, manufacturing yield, reliability, quality, and field performance to meet operational and customer requirements.
Ensure products meet defined electrical, mechanical, quality, reliability, and manufacturing requirements throughout the product lifecycle.
2. Yield Engineering & Continuous Improvement
Analyze manufacturing and post-manufacturing test data using statistical analysis and data-mining techniques to identify trends/risk, root causes, and improvement opportunities.
Drive corrective and preventive actions to improve yield, quality, cost, and manufacturing efficiency.
Identify opportunities for continuous improvement.
Establish appropriate sampling and data collection strategies from volume production units to monitor and optimize product and process performance.
3. Manufacturing Readiness & Production Support
Support production ramp-up and soft launch activities, monitoring product and process performance against defined targets.
Support customer and internal technical reviews related to product performance, manufacturing readiness, quality, and reliability.
4. Product Engineering & Process Development
Evaluate PCB and substrate manufacturing processes and their impact on product electrical, mechanical, and reliability performance.
Apply knowledge of key PCB/substrate manufacturing processes, including:
Build-up insulation
Dry Film Resist (DFR) patterning
Plating
Solder resist
Automated Optical Inspection (AOI)
Automated Optical Shaping (AOS)
Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Qualifications & Requirements
Bachelor’s degree or higher in Electrical and Electronics Engineering, Electrical Engineering, Mechanical Engineering, or a related engineering discipline.
Minimum 4–5 years of relevant experience in product engineering, semiconductor manufacturing, electronics manufacturing, or related industries.
Strong background in product engineering, semiconductor packaging, PCB/substrate manufacturing, and process development.
Hands-on experience with manufacturing processes and product characterization, yield analysis, troubleshooting, and failure analysis.
Experience leading or supporting NPI projects from product verification and qualification through production ramp and high-volume manufacturing is highly desirable.
Strong understanding of mechanical engineering principles and their application to semiconductor packaging and product performance.
Self-motivated, proactive, and able to work independently with minimal supervision.
Strong interpersonal, communication, and cross-functional collaboration skills.
Company Name: ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.
Plant Address: 9 Pesawat Drive, Singapore 619607
Established in 2023, Advanced Substrate Technologies (AST) is a member of the TOPPAN Group, a global leader in integrated printing solutions.
Located in Singapore, a global semiconductor hub, AST plays a pivotal role in shaping the forefront of the cutting-edge semiconductor ecosystem.
AST specialises in the development, manufacturing, and sale of high-density semiconductor packages, such as FC-BGA, along with related components.
This strategic focus is a response to the growing demand for cutting-edge solutions for the data centre servers and the AI-related applications.
True to our name, AST is committed to delivering state-of-the-art technology integrated into its substrate products, with plans to commence mass production in 2027.
Join us on our journey to advance semiconductor innovation and become a part of our exceptional team. Your future with AST awaits.
The Product Engineer (PE) / First Article Inspection Engineer (FAI) serves as a key technical interface between Design Engineering, Manufacturing, Process Engineering, Quality, and customer requirements. The role is responsible for driving product bring-up, New Product Introduction (NPI), FAI, manufacturing readiness, yield improvement, failure analysis, and continuous improvement throughout the product lifecycle—from initial product introduction through mass production and end-of-life.
The ideal candidate has strong experience in product engineering and semiconductor/electronics manufacturing, with hands-on knowledge of PCB/substrate fabrication, electrical and mechanical performance, manufacturing processes, statistical data analysis, yield improvement, and failure analysis.
1. Product Ownership & Manufacturing Excellence
Lead end-to-end ownership of assigned products throughout the product lifecycle, from design, NPI, and FAI through mass production and end-of-life.
Drive and monitor product performance, manufacturing yield, reliability, quality, and field performance to meet operational and customer requirements.
Ensure products meet defined electrical, mechanical, quality, reliability, and manufacturing requirements throughout the product lifecycle.
2. Yield Engineering & Continuous Improvement
Analyze manufacturing and post-manufacturing test data using statistical analysis and data-mining techniques to identify trends/risk, root causes, and improvement opportunities.
Drive corrective and preventive actions to improve yield, quality, cost, and manufacturing efficiency.
Identify opportunities for continuous improvement.
Establish appropriate sampling and data collection strategies from volume production units to monitor and optimize product and process performance.
3. Manufacturing Readiness & Production Support
Support production ramp-up and soft launch activities, monitoring product and process performance against defined targets.
Support customer and internal technical reviews related to product performance, manufacturing readiness, quality, and reliability.
4. Product Engineering & Process Development
Evaluate PCB and substrate manufacturing processes and their impact on product electrical, mechanical, and reliability performance.
Apply knowledge of key PCB/substrate manufacturing processes, including:
Build-up insulation
Dry Film Resist (DFR) patterning
Plating
Solder resist
Automated Optical Inspection (AOI)
Automated Optical Shaping (AOS)
Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Qualifications & Requirements
Bachelor’s degree or higher in Electrical and Electronics Engineering, Electrical Engineering, Mechanical Engineering, or a related engineering discipline.
Minimum 4–5 years of relevant experience in product engineering, semiconductor manufacturing, electronics manufacturing, or related industries.
Strong background in product engineering, semiconductor packaging, PCB/substrate manufacturing, and process development.
Hands-on experience with manufacturing processes and product characterization, yield analysis, troubleshooting, and failure analysis.
Experience leading or supporting NPI projects from product verification and qualification through production ramp and high-volume manufacturing is highly desirable.
Strong understanding of mechanical engineering principles and their application to semiconductor packaging and product performance.
Self-motivated, proactive, and able to work independently with minimal supervision.
Strong interpersonal, communication, and cross-functional collaboration skills.
Company Name: ADVANCED SUBSTRATE TECHNOLOGIES PTE. LTD.
Plant Address: 9 Pesawat Drive, Singapore 619607
Established in 2023, Advanced Substrate Technologies (AST) is a member of the TOPPAN Group, a global leader in integrated printing solutions.
Located in Singapore, a global semiconductor hub, AST plays a pivotal role in shaping the forefront of the cutting-edge semiconductor ecosystem.
AST specialises in the development, manufacturing, and sale of high-density semiconductor packages, such as FC-BGA, along with related components.
This strategic focus is a response to the growing demand for cutting-edge solutions for the data centre servers and the AI-related applications.
True to our name, AST is committed to delivering state-of-the-art technology integrated into its substrate products, with plans to commence mass production in 2027.
Join us on our journey to advance semiconductor innovation and become a part of our exceptional team. Your future with AST awaits.
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