全职 Engineer - Process (Assembly-NPI) 工作, 薪水 up to MYR 6,000, ASE Semiconductor (Penang) Pulau Pinang 公司招聘中 - Ricebowl

Job description

• Own assigned manufacturing processes to achieve yield, quality, productivity, and cost targets.
• Drive process optimization, troubleshooting, root cause analysis, and continuous improvement initiatives.
• Serve as the process engineering focal point for NPI programs & support process qualification, validation and production ramp-up activities.
• Review manufacturing readiness including process capability, tooling, equipment, materials, capacity, and documentation.
• Identify and drive closure of technical, operational, quality, and cost-related gaps prior to production release.
• Coordinate with Product Engineering, Quality, Manufacturing, Equipment Engineering, and Supply Chain teams to ensure successful product introductions.
• Develop and maintain process documentation, control plans, and risk assessments.
• Provide readiness recommendations and risk assessments to management for production release decisions.

Qualifications

• Bachelor's Degree in Mechanical, Materials, Manufacturing, Electrical, Mechatronics, Chemical Engineering, or related discipline.
• 2-5 years of semiconductor manufacturing, process engineering, NPI, package development, or product engineering experience.
• Experience with semiconductor assembly or backend manufacturing processes.
• Familiar with NPI, process qualification, and production ramp activities.
• Knowledge of DOE, SPC, MSA, FMEA, Control Plan, 8D, and structured problem solving.
• Experience in yield improvement, process optimization, and cost reduction projects.
• Strong analytical and data-driven decision-making capability.
• Good project coordinating skills & manage stakeholders across multiple functions.
• Experience in NPI handoff/handshake, manufacturing readiness assessment, product transfer, or production ramp-up will be an added advantage.
• Experience in Mold process is an advantage.

Pay: RM4,000.00 - RM6,000.00 per month

Benefits:

• Health insurance
• Maternity leave
• Meal allowance

Application Question(s):

• Do you have 2-5 years of experience in semiconductor manufacturing, process engineering, NPI, package development, or product engineering?
• Do you have hands-on experience with semiconductor assembly or backend manufacturing processes?
• Have you been directly involved in NPI, process qualification, manufacturing readiness assessments, product transfers, or production ramp-up activities?
• What are your salary expectations? (in RM)
• What are your notice period? (in Months)

Work Location: In person