全职 Package Designer 工作, 薪水 up to SGD 7,000, SILICON BOX PTE. LTD. East Region (Singapore) 公司招聘中 - Ricebowl

Position Summary

The

Package Designer

is responsible for product and tooling design.

Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.

Responsibilities

With reference to internal design guidelines, work with the internal & external customer to:

• Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
• Generate test vehicle design and the related PCB design.
• Prepare design risk assessment report.
• Generate reticle and stencil design.
• Generate other schematics or drawing as requested.

Review, maintenance and update the design guidelines.

Manage the conversion of internal design into suppliers’ final design.

Document all the drawing revisions and change records.

Support audits

Any other ad-hoc duties as assigned

Requirements

Master’s Degree in electrical/ electronics engineering, or similar discipline

Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability

Experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes will be an advantage

Hands-on skills on design software tools like Linkcad, Cadence, CAM350, AutoCAD, GDS, Gerber editors

Experience with PCB test board design

Fresh graduates are welcome to apply

Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.

We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.