Management of product sustaining activities which include driving product margin and performance improvement (yield, test time, quality, etc.) and cost reduction
Manage the introduction of new products and their ramp to volume production
Work with the Manufacturing, Design, Quality, and Failure Analysis teams in the disposition of product excursions and manage cases through a material review board manufacturing (MRB)
Leveraging data analytics to manage and predict yield, set aggressive goal and plan to achieve yield improvement, cost reduction and continuity supply
Test program owner that governs trim and probe, supporting production bring up, issue debugging and continuous improvement for product indices in HVM stage
Fully responsible to buyoff and review all new test program release to production
Provide Operation Supports on issues troubleshooting and lead the team to identify the solutions for test related issues
Working with NPI development team to understand the test coverage evaluation, test flow integration and test hardware qualification
Post release sustaining activities: Set up automated yield monitors, disposition of early production hold lots, drive the resolution of customer and production yield issue
Promotes and adheres to Company’s commitment on corporate social responsibility.
Minimum Qualifications:
BS or MS degree in EE or ECE or equivalent relevant experience.
Minimum 2 years of experience in Yield Integration or Product Engineering
Fresh Graduate encourages to apply
Preferred:
Strong analytical skills, ability to solve complex problems through design of appropriate experiments and analysis of complex data.
Self-motivated and driven to continually improve
Ability to communicate effectively, both written and verbal
Knowledge of IC fabrication and process technology
Circuits knowledge that includes one or more of the following: analog circuits, RF circuits, Power Management circuits, Mixed-signals and systems, ADCs, DACs, optical, high speed serial interfaces, microcontrollers, DSPs