- Singapore
工作地点
职位描述
岗位职责
Looking for highly skilled and expere3nced engineering talents to be part of the R & D team in Singapore for the advanced photonics packaging design and process development.
You should have a deep understanding of photonics and semiconductor technologies, extensive hands-on experience in developing and implementing advanced packaging solutions.
Responsibilities
Lead and design, develop, optimized of advanced photonics packaging solutions and processes for fiber optic interconnect products, including pluggable optical transceivers.
Define test strategy, DFM matrix and requirements of new products and process development, manage prototypes and work with manufacturing teams to scale processes for high volume production.
Qualifications
Bachelor or above in Electrical Engineering, Mechanical Engineering , Physics, Material Scienceor related field
Minimum 10 years of experience in advanced packaging design and process development
Extensive knowledge of optical communication, high speed transcievers, MEMS , 2.5D/3D silicon photonics packaging and processes.
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