Responsibilities
Responsible for daily operational equipment issues and strategize recovery actions to support production requirement
Perform equipment buy-off and qualification for machine installation, modification, upgrade and maintenance
Involve in WLCSP process (Taping & Detaping, Wafer Mount, Backgrinding, Laser Grooving, Laser Mark, Dicing, AOI, Die Sort etc)
Monitor and analyse equipment performance and reliability
Requirements
Diploma / Higher NITEC / NITEC in Electronic / Electrical / Mechanical / Mechatronics Engineering or equivalent
Tape and Reel experience in wafer level and knowledge on vision system is preferred
Possess strong analysis and good teamwork
Good communication and interpersonal skills
Able to work 12 hours night shift
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.