- Yishun North Region (Singapore) Singapore
全职 Associate Equipment Engineer – Mold Processes 工作, 薪水 up to SGD 2,700, STATS ChipPAC Pte. Ltd. North Region (Singapore) 公司招聘中 - Ricebowl
Associate Equipment Engineer – Mold Processes
STATS ChipPAC Pte. Ltd.
分享
保存
工作地点
职位描述
岗位职责
About us
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
We are looking for an Associate Equipment Engineer (AE) to support the Molding process and ensure high equipment availability, reliability, and production support. The engineer will be responsible for equipment troubleshooting, repair, preventive maintenance, and continuous improvement activities for Molding machines.
Key responsibilities
Provide 12-hour shift equipment support for Mold production.
Troubleshoot and repair Daiichi mold equipment during equipment breakdowns.
Perform preventive maintenance and equipment inspections according to the established schedule.
Analyze equipment failures and implement corrective actions to prevent recurrence.
Support Daiichi mold machine setup, qualification, and equipment release for production.
Monitor equipment performance, downtime, and machine availability.
Support continuous improvement activities to improve equipment OEE, MTBF, MTTR, and machine reliability.
Maintain proper documentation of equipment breakdowns, PM activities, and corrective actions.
Work closely with Production and Process Engineering to resolve equipment-related issues.
Support both day and night shifts according to the production manpower schedule.
What we're looking for
Diploma in Electrical or Mechanical Engineering.
At least 2 years of practical equipment maintenance experience.
Hands-on experience with Daiichi Mold machines is highly preferred.
Strong troubleshooting and machine repair skills.
Willingness and ability to work 12-hour rotating shifts, including day and night shifts.
Able to work independently during shift operations and make timely decisions during equipment breakdowns.
Good problem-solving skills and a strong ownership mindset.
Knowledge of tooling design and maintenance is an advantage.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.
About the role
We are looking for an Associate Equipment Engineer (AE) to support the Molding process and ensure high equipment availability, reliability, and production support. The engineer will be responsible for equipment troubleshooting, repair, preventive maintenance, and continuous improvement activities for Molding machines.
Key responsibilities
Provide 12-hour shift equipment support for Mold production.
Troubleshoot and repair Daiichi mold equipment during equipment breakdowns.
Perform preventive maintenance and equipment inspections according to the established schedule.
Analyze equipment failures and implement corrective actions to prevent recurrence.
Support Daiichi mold machine setup, qualification, and equipment release for production.
Monitor equipment performance, downtime, and machine availability.
Support continuous improvement activities to improve equipment OEE, MTBF, MTTR, and machine reliability.
Maintain proper documentation of equipment breakdowns, PM activities, and corrective actions.
Work closely with Production and Process Engineering to resolve equipment-related issues.
Support both day and night shifts according to the production manpower schedule.
What we're looking for
Diploma in Electrical or Mechanical Engineering.
At least 2 years of practical equipment maintenance experience.
Hands-on experience with Daiichi Mold machines is highly preferred.
Strong troubleshooting and machine repair skills.
Willingness and ability to work 12-hour rotating shifts, including day and night shifts.
Able to work independently during shift operations and make timely decisions during equipment breakdowns.
Good problem-solving skills and a strong ownership mindset.
Knowledge of tooling design and maintenance is an advantage.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
重要安全守则
申请工作时，切勿提供您的银行或信用卡详细资料。不要转账或完成无关的在线调查问卷。如果您发现可疑内容，请举报此招聘广告。
了解更多