- Geylang Southeast (Singapore) Singapore
全职 TCB Process Engineer 工作, 薪水 up to SGD 12,000, ADAPTIVE TECHNOLOGY SINGAPORE PTE. LTD. Southeast (Singapore) 公司招聘中 - Ricebowl
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Job Summary
Lead the development and optimization of Thermal Compression Bonding (TCB) processes to enhance product yield and production efficiency. Collaborate cross-functionally to ensure smooth new product introduction and continuous process improvement in semiconductor packaging.
Responsibilities
Evaluate and formulate process flows for new TCB products to ensure Design for Manufacturability (DFM) through functional verification of modules
Lead development and debugging of TCB process parameters including temperature, pressure, time, and heating/cooling rates to resolve bottlenecks such as warpage, coplanarity, and void rate
Drive Continuous Improvement Plan (CIP) initiatives for major equipment and product abnormalities by leading Failure Analysis (FA) and issuing improvement reports
Collaborate with R&D, Quality, and Production teams during New Product Introduction (NPI) projects to resolve R&D phase issues and facilitate smooth transition from pilot run to mass production
Monitor production process stability using statistical metrics (Cpk/Ppk) and adjust parameters proactively based on data analysis
Develop and maintain operational documentation including Process Flow Diagrams (PFD), Standard Operating Procedures (SOP), equipment operation and maintenance specifications, inspection standards, Out of Control Action Plan (OCAP), and EFMEA
Preferred competencies and qualifications
Bachelor’s degree or above in Electronics, Mechanical Engineering, Automation, Materials Science, Physics, Chemistry, or related fields; Master’s degree preferred
Minimum 3 years’ experience in TCB-related equipment and process development in semiconductor packaging; experience in 2.5D/3D advanced packaging and HBM stacking highly preferred
Familiarity with Thermal Compression Bonding (TCB) or Hybrid Bonding (HB) processes
Proficiency in operating, debugging, and troubleshooting mainstream TCB/FC equipment such as ASM Firebird/Adept, Shibaura, K&S Aptura, Datacon, Hanmi
Deep understanding of thermal compression bonding mechanisms; experience with Fluxless bonding, Formic Acid reduction, or Underfill processes highly preferred
Strong data analysis skills using statistical software like JMP and Minitab for Design of Experiments (DOE) and yield analysis
Demonstrated quality awareness and hands-on problem-solving ability under pressure, including willingness to work overtime when necessary
Excellent communication, coordination, and teamwork skills
Lead the development and optimization of Thermal Compression Bonding (TCB) processes to enhance product yield and production efficiency. Collaborate cross-functionally to ensure smooth new product introduction and continuous process improvement in semiconductor packaging.
Responsibilities
Evaluate and formulate process flows for new TCB products to ensure Design for Manufacturability (DFM) through functional verification of modules
Lead development and debugging of TCB process parameters including temperature, pressure, time, and heating/cooling rates to resolve bottlenecks such as warpage, coplanarity, and void rate
Drive Continuous Improvement Plan (CIP) initiatives for major equipment and product abnormalities by leading Failure Analysis (FA) and issuing improvement reports
Collaborate with R&D, Quality, and Production teams during New Product Introduction (NPI) projects to resolve R&D phase issues and facilitate smooth transition from pilot run to mass production
Monitor production process stability using statistical metrics (Cpk/Ppk) and adjust parameters proactively based on data analysis
Develop and maintain operational documentation including Process Flow Diagrams (PFD), Standard Operating Procedures (SOP), equipment operation and maintenance specifications, inspection standards, Out of Control Action Plan (OCAP), and EFMEA
Preferred competencies and qualifications
Bachelor’s degree or above in Electronics, Mechanical Engineering, Automation, Materials Science, Physics, Chemistry, or related fields; Master’s degree preferred
Minimum 3 years’ experience in TCB-related equipment and process development in semiconductor packaging; experience in 2.5D/3D advanced packaging and HBM stacking highly preferred
Familiarity with Thermal Compression Bonding (TCB) or Hybrid Bonding (HB) processes
Proficiency in operating, debugging, and troubleshooting mainstream TCB/FC equipment such as ASM Firebird/Adept, Shibaura, K&S Aptura, Datacon, Hanmi
Deep understanding of thermal compression bonding mechanisms; experience with Fluxless bonding, Formic Acid reduction, or Underfill processes highly preferred
Strong data analysis skills using statistical software like JMP and Minitab for Design of Experiments (DOE) and yield analysis
Demonstrated quality awareness and hands-on problem-solving ability under pressure, including willingness to work overtime when necessary
Excellent communication, coordination, and teamwork skills
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