全职 Engineer, Back-end Operation 工作, 薪水 up to SGD 5,500, STMICROELECTRONICS ASIA PACIFIC PTE LTD North-east Region (Singapore) 公司招聘中 - Ricebowl

Job Summary

Drive & qualify new product introduction (NPI) with new back-end technology bricks for advanced Imaging Sensor package (Optical Module, Chip Scale Package) from early concept through high volume in collaboration with internal Process R&D, Manufacturing and Suppliers Management organization.

Coordinate & collaborate to solve complex technical bottlenecks in back-end technology process. Assess process changes & excursions supporting quality organization with internal and external customers.

It requires strong technical skills, solid stakeholder management and negotiation abilities, individual leadership and a multi-cultural approach. The role carries a high level of autonomy, accountability and decision-making skills together with the ability to lead complex international initiatives with a strong data driven mindset and influence stakeholders at multiple organizations levels. 

Key focus includes technical gap assessment, Gross margin improvement & manufacturing performance to meet operations targets. On-time execution & technical issues solving to meet New Product Introduction milestones with full compliance on sustainability and quality requirement.

The Job requires flexibility to travel in South-East Asia (ST sites & Suppliers) & occasionally in Europe & USA. 

Key responsibilities

• Drive alignment among diverse stakeholders (Package R&D, QMT, Quality, Planning, BU) to achieve common business, technology, and operational goals
• Coordinating Back-end process technology development & qualification from early concept to Mass Production ramp involving direct interactions with end customers. 
• Drive execution with multiple teams through structured coordination, tight follow-up to ensure program alignment and risk mitigation.

Requirements

• Bachelor / Master’s degree in Engineering, Mechanical Engineering, Industrial Engineering, or Materials Science
• Experience in CMOS image sensors or advanced packaging technology
• Experience in IC or electronics industrialization from early concept to volume production
• Established experience of technical issues solved to meet critical milestones with strong knowledge on key data software analysis such as JMP and MATLAB
• Able to work independently with minimal supervision and collaborate effectively in a multicultural team